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    Shared Spotlight
    SEMICON Europa 2026 logo

    5 Exhibitors to Visit at SEMICON Europa 2026

    This set covers buyer jobs across process control and metrology, etch and deposition, 3D integration and hybrid bonding, automated test equipment, and wet cleaning for both advanced and specialty semiconductor production.

    10–13 November 2026Messe MünchenMunich, Germany6 min read

    Paid placement disclosure. These exhibitor sections are paid Shared Spotlight placements. Inclusion is not an award, ranking, or TradeShowIntel endorsement, and it does not affect independent Floor Picks.Disclosure version 2026-09

    Why a planned route matters at SEMICON Europa 2026

    SEMICON Europa 2026 runs from 10 to 13 November at Messe München in Munich, drawing hundreds of exhibitors across semiconductor equipment, materials, process technology, and advanced packaging into a venue large enough that an unplanned walk rarely covers every priority stand before the afternoon sessions pull buyers away from the floor.

    The five companies in this Shared Spotlight, KLA, Lam Research India Pvt. Ltd., EV-Group, Advantest Singapore, and SCREEN SPE Germany GmbH, collectively address a connected sequence of buyer jobs: controlling process quality and yield, running etch and deposition and clean steps, integrating chiplets and 3D structures through bonding and lithography, qualifying devices on test platforms, and maintaining wafer surface cleanliness through wet and thermal processing. Visiting them in order gives a process or equipment procurement team a coherent view of the front-end-to-packaging workflow without doubling back across the hall.

    Why these exhibitors

    A coherent set of buyer jobs, not a random sample

    These five companies were placed together because they address sequential steps in semiconductor manufacturing and packaging procurement. A process control or yield engineering buyer evaluating inspection and metrology tools will find KLA relevant. A process integration engineer sourcing etch, deposition, or clean platforms will find Lam Research India Pvt. Ltd. and SCREEN SPE Germany GmbH relevant. An advanced packaging or 3D integration engineer working on chiplet, HBM, or co-packaged optics programs will find EV-Group directly applicable. A test engineer or procurement lead qualifying ATE platforms for memory or SoC devices will find Advantest Singapore worth dedicated time. The set is not presented as a comprehensive market survey. It reflects the five companies that purchased placement in this Shared Spotlight, and buyers should continue their research across the full SEMICON Europa exhibitor list.

    How to use this Shared Spotlight

    1. Download the hall map before you arrive SEMICON Europa concentrates much of its equipment exhibitor floor in Hall B1 at Messe München. Confirm booth numbers for all five companies on the official floor plan at semiconeuropa.org before your travel day, because late booth assignments can shift positions.
    2. Anchor on the confirmed booth numbers first KLA is confirmed at Hall B1, booth B1141, and EV-Group is confirmed at Hall B1, booth B1241. Use those two fixed points to orient your walk and slot the remaining three stands, Lam Research India Pvt. Ltd., Advantest Singapore, and SCREEN SPE Germany GmbH, once their positions appear on the published floor plan.
    3. Match each stand to the buyer in your group Each exhibitor card in this guide includes a specific buyer role. Share the relevant card with the right colleague before entering the hall so the process control engineer, the packaging engineer, and the test lead each know which stand is their priority and what to ask.
    4. Leave buffer time between stands Messe München is a large venue and Hall B1 can be congested during peak morning hours. Build at least 15 minutes of transit and queue time between each stand, particularly around the KLA and EV-Group booths where demonstration equipment tends to draw crowds.

    Floor-planning tip Block the first two hours after the hall opens on day one for this five-stand route, as booth staff are most available before the midday keynote breaks bring heavier foot traffic.

    TL;DR

    5 stops worth planning

    Suggested floor route

    Start at KLA, finish at SCREEN SPE

    Beginning at KLA in booth B1141, moving to Lam Research India Pvt. Ltd., then crossing to EV-Group at B1241, continuing to Advantest Singapore, and closing at SCREEN SPE Germany GmbH traces a path that keeps the walk largely within Hall B1 and avoids the need to retrace steps across the broadest span of the floor.

    1. 1KLAPrioritize this stand if you are a process control or yield engineering buyer at a foundry, memory fab, or advanced packaging facility evaluating inspection, metrology, or direct imaging tools for current or next-generation nodes.Hall B1 · B1141
    2. 2Lam Research India Pvt. Ltd.Prioritize this stand if you are a process integration engineer or fab equipment buyer evaluating etch, deposition, or clean platforms for an advanced node ramp or new European fab program.Hall C (C‑hall), Booth C1232
    3. 3EV-GroupPrioritize this stand if you are an advanced packaging or 3D integration engineer evaluating production-qualified fusion bonding, hybrid bonding, or maskless lithography for chiplet, HBM, or co-packaged optics programs.Hall B1 · B1241
    4. 4Advantest SingaporePrioritize this stand if you are a test engineer or procurement lead evaluating ATE platforms for memory, SoC, or advanced-node device qualification.Hall B1 · B1706, B1712
    5. 5SCREEN SPE Germany GmbHPrioritize this stand if you are a process engineer or equipment procurement manager at a European fab or research institute evaluating wet cleaning or thermal processing tools for advanced or specialty semiconductor production.Hall B1, Booth B1700
    KLA logo

    KLA

    Supplier of semiconductor process control, inspection, metrology, and yield-management equipment and data analytics for wafer, reticle, packaging, and PCB manufacturing.

    BoothB1141Hall B1
    Read company profilePrioritize this stand if you are a process control or yield engineering buyer at a foundry, memory fab, or advanced packaging facility evaluating inspection, metrology, or direct imaging tools for current or next-generation nodes.Read more

    About

    KLA Corporation, headquartered in Milpitas, California and founded in 1975, employs approximately 16,000 people and reported CY2025 revenue of $12.74 billion. The company supplies process control and process-enabling equipment across wafer inspection, metrology, reticle qualification, advanced packaging, and PCB and IC substrate manufacturing. Its product portfolio includes Broadband Plasma optical inspection systems, the Axion T2000 X-ray metrology platform, the ICOS F260 die sorting and component inspection tool, and the Orbotech Corus 8M direct imaging system for HDI interconnects.

    KLA's advanced packaging systems segment generated approximately $950 million in CY2025, representing over 70 percent year-on-year growth, reflecting accelerating demand from customers scaling 2.5D, 3D, and chiplet architectures. The company's services business has grown at a compound annual rate above 12 percent across 16 consecutive years, supported by a large global installed base spanning 18 regions. CY2025 R&D investment reached $1.44 billion, underpinning continued development across broadband plasma defect detection, X-ray metrology for complex vertical memory structures, and molecular vapor deposition technology.

    As the market leader in process control, KLA is well positioned to take advantage of this long-term trend. As we look forward to calendar year 2026, KLA is a key enabler of the AI ecosystem and continues to uniquely benefit from the AI infrastructure buildout across all major growth vectors, including foundry/logic, memory, advanced packaging, and services.

    At SEMICON Europa 2026

    At SEMICON Europa 2026, KLA is exhibiting as a platinum sponsor in Hall B1, stand B1141, presenting its in-situ process monitoring and control products, defect inspection and metrology systems, and wafer processing technology solutions. Visitors can expect demonstrations covering Broadband Plasma inspection, X-ray metrology, and molecular vapor deposition technology. KLA technical staff are also presenting at two co-located summits: Richard Barnett discusses etch and deposition processes for compound semiconductors at the III-V Summit on November 12, and Paul Hammond covers molecular vapor deposition technology at the MEMS and Imaging Sensors Summit on November 11.

    Broadband Plasma optical inspection for patterned wafer defect detection at advanced logic and DRAM/HBM nodesAxion T2000 X-ray metrology for vertical NAND and other complex 3D memory structuresAdvanced packaging inspection roadmap covering 2.5D, 3D, and chiplet integrationOrbotech Corus 8M direct imaging and ICOS F260 AOI for HDI PCB and IC substrate productionIn-situ process monitoring, molecular vapor deposition, and compound semiconductor etch/deposition presentations at co-located summitsWafer InspectionX-Ray MetrologyAdvanced PackagingDirect Imaging
    Why visit

    Prioritize this stand if you are a process control or yield engineering buyer at a foundry, memory fab, or advanced packaging facility evaluating inspection, metrology, or direct imaging tools for current or next-generation nodes.

    What to ask at the booth

    • How does your Broadband Plasma inspection platform handle defect detection at the most advanced logic and DRAM/HBM nodes?
    • Which metrology systems do you recommend for characterizing vertical NAND and other 3D memory structures?
    • What is your roadmap for advanced packaging inspection as customers move to 2.5D/3D and chiplet architectures?
    • How do your data analytics and services offerings tie into yield management across an installed base?
    • What direct imaging and AOI options do you offer for HDI PCB and IC substrate production?
    Lam Research India Pvt. Ltd. logo

    Lam Research India Pvt. Ltd.

    Semiconductor wafer fabrication equipment: etch, deposition, and clean

    BoothC1232Hall C1/C2 area
    Read company profilePrioritize this stand if you are a process integration engineer or fab equipment buyer evaluating etch, deposition, or clean platforms for an advanced node ramp or new European fab program.Read more

    About

    Lam Research India Pvt. Ltd. is the Indian subsidiary of Lam Research Corporation, a global supplier of wafer fabrication equipment used in the manufacture of integrated circuits. The parent company is headquartered in Fremont, California, and its product portfolio spans plasma etch systems, chemical vapor deposition, atomic layer deposition, and wafer cleaning equipment deployed across memory, logic, and foundry fabs worldwide.

    Lam Research holds significant installed-base depth in high-volume memory and advanced logic manufacturing, with equipment used at critical process steps including multi-patterning etch and selective deposition. The India entity supports engineering, customer operations, and R&D functions that feed into global customer engagements, reflecting the company's expanding presence in the region as semiconductor supply chains diversify.

    At SEMICON Europa 2026

    SEMICON Europa draws process engineers, fab procurement teams, and equipment evaluators from across Europe's expanding semiconductor manufacturing base. Visitors to Lam Research's presence at the show can expect discussions centered on etch and deposition solutions relevant to advanced node scaling, as well as the cleaning systems that support yield-sensitive applications. The stand is a practical stop for anyone evaluating capital equipment roadmaps ahead of new fab buildouts or technology node transitions.

    Plasma etch systems for advanced logic and memory patterningAtomic layer deposition and selective deposition capabilitiesWafer cleaning equipment for yield-critical process stepsSupport model and customer operations structure out of India engineering centersEquipment roadmap alignment with multi-patterning and 3D device architecturesEtchDepositionWafer CleanFab Equipment
    Why visit

    Prioritize this stand if you are a process integration engineer or fab equipment buyer evaluating etch, deposition, or clean platforms for an advanced node ramp or new European fab program.

    What to ask at the booth

    • Which etch or deposition platforms are you positioning for European fab buildouts at sub-5nm nodes?
    • How does the India engineering center interact with European customer support and process integration teams?
    • What is the lead time and local service coverage model for new equipment installations in Europe?
    • How are your ALD and selective deposition tools being adapted for gate-all-around transistor structures?
    • What consumables or parts supply options are available to reduce downtime for existing installed-base customers?
    EV-Group logo

    EV-Group

    Supplier of high-volume wafer bonding, lithography, thin-wafer processing, and metrology equipment for semiconductor front-end, 3D integration, and advanced packaging.

    BoothB1241B1
    Read company profilePrioritize this stand if you are an advanced packaging or 3D integration engineer evaluating production-qualified fusion bonding, hybrid bonding, or maskless lithography for chiplet, HBM, or co-packaged optics programs.Read more

    About

    EV Group (EVG), headquartered in St. Florian am Inn, Austria and founded in 1980, employs more than 1,700 people and supplies production equipment for wafer bonding, lithography, thin-wafer processing, and metrology. The company serves semiconductor front-end scaling, MEMS manufacturing, 3D integration, and advanced packaging through fully-owned subsidiaries in the U.S., Japan, South Korea, China, Taiwan, and Singapore, with application labs and cleanrooms across Europe, North America, and Asia.

    EVG holds a long-standing position in production wafer bonding, having delivered systems to the MEMS industry for more than 30 years and introduced the first production wafer bonding system for MEMS in 1992. Its GEMINI FB fusion bonding platform is widely regarded as the de facto production standard for fusion bonding, and the company works with nearly every major semiconductor and MEMS manufacturer. EVG is ISO 9001:2015 and ISO 14001 certified.

    For three decades, EVG North America has played a key role in supporting our customers as we've advanced the semiconductor industry roadmap with our fusion and hybrid bonding, lithography, and metrology process solutions.

    At SEMICON Europa 2026

    At SEMICON Europa 2026, EVG is presenting its full portfolio of wafer bonding, lithography, and metrology equipment at Stand B1241 in Hall B1. The team is delivering two poster presentations at the Advanced Packaging Conference: one covering software-driven strategies for advanced multi-die patterning in digital lithography, and one addressing how advanced bonding technologies enable scalable co-packaged optics architectures. Visitors can discuss production-ready platforms including the GEMINI FB fusion bonding system, the LITHOSCALE XT maskless digital lithography system, the EVG40 D2W die-to-wafer overlay metrology system, and the EVG880 LayerRelease infrared layer-release platform.

    GEMINI FB: automated production fusion and hybrid wafer bonding, positioned as the de facto industry standard for fusion bondingLITHOSCALE XT: maskless digital lithography with up to 5X higher throughput, stitch-free full-wafer patterning, and real-time die-shift compensationEVG40 D2W: 100 percent die overlay measurement at high throughput for hybrid bonding and chiplet integrationEVG880 LayerRelease: infrared layer-release platform for ultra-thin chiplet stacking and 3D layer transfer, recipient of the 2024 Best of West awardAPC poster presentations on multi-die digital lithography patterning and co-packaged optics bonding architecturesHybrid bondingMaskless lithography3D integrationAdvanced packaging
    Why visit

    Prioritize this stand if you are an advanced packaging or 3D integration engineer evaluating production-qualified fusion bonding, hybrid bonding, or maskless lithography for chiplet, HBM, or co-packaged optics programs.

    What to ask at the booth

    • What are the differences between your wafer-to-wafer and die-to-wafer hybrid bonding offerings for our packaging flow?
    • How does the EVG40 D2W improve overlay control and yield in high-volume die-to-wafer bonding?
    • What throughput and resolution can LITHOSCALE XT achieve for our panel-level or interposer application?
    • Can you share yield or adoption data from GEMINI FB installs in production fabs?
    • What local process support and demo capability do you offer in Europe for development runs?
    Advantest Singapore logo

    Advantest Singapore

    Semiconductor test systems and test handler equipment

    BoothB1706Hall B1
    Read company profilePrioritize this stand if you are a test engineer or procurement lead evaluating ATE platforms for memory, SoC, or advanced-node device qualification.Read more

    About

    Advantest Singapore is part of Advantest Corporation, a global manufacturer of automatic test equipment for semiconductors. The company supplies test systems covering memory, logic, and mixed-signal devices, along with device handlers and related test peripherals used across the chip production cycle.

    Advantest holds a significant share of the global ATE market and serves major integrated device manufacturers, foundries, and outsourced semiconductor assembly and test providers. Its Singapore presence supports Asia-Pacific customer operations and positions the entity as a regional hub for sales, application engineering, and service coverage.

    At SEMICON Europa 2026

    Advantest Singapore is listed as an exhibitor at SEMICON Europa 2026 in Munich. Visitors working in test engineering, device qualification, or fab operations can expect the stand to reflect Advantest's broad ATE portfolio, which spans memory test, SoC test, and handler automation. Specific product demonstrations or launch announcements for this event have not been confirmed in available pre-show information.

    Automatic test equipment for memory and SoC device categoriesDevice handler and wafer-level test integrationRegional application engineering and service support from SingaporeTest coverage across IDM, foundry, and OSAT customer segmentsATEDevice TestSemiconductor EquipmentTest Handlers
    Why visit

    Prioritize this stand if you are a test engineer or procurement lead evaluating ATE platforms for memory, SoC, or advanced-node device qualification.

    What to ask at the booth

    • Which test platforms are being highlighted for advanced packaging and chiplet architectures?
    • What handler configurations are available for high-temperature or cryogenic test requirements?
    • How does Advantest's Singapore team support European customers on service and spare parts logistics?
    • What roadmap exists for test solutions targeting wide-bandgap semiconductors such as SiC and GaN?
    SCREEN SPE Germany GmbH logo

    SCREEN SPE Germany GmbH

    Semiconductor process equipment, surface treatment, and wet cleaning systems

    BoothB1700Hall B1
    Read company profilePrioritize this stand if you are a process engineer or equipment procurement manager at a European fab or research institute evaluating wet cleaning or thermal processing tools for advanced or specialty semiconductor production.Read more

    About

    SCREEN SPE Germany GmbH is the European subsidiary of SCREEN Semiconductor Solutions, a division of SCREEN Holdings Co., Ltd., operating within the semiconductor equipment sector. The company supports European chipmakers and research institutes with equipment and service related to wafer cleaning, surface conditioning, and thermal processing.

    SCREEN's parent group is one of the larger dedicated suppliers of single-wafer wet cleaning and batch processing systems globally, with installed bases at major logic and memory fabs. The German entity provides regional sales, applications support, and field service, positioning it as a local point of contact for European customers evaluating or operating SCREEN equipment.

    At SEMICON Europa 2026

    SCREEN SPE Germany GmbH is exhibiting at SEMICON Europa 2026 at Messe München. Given the company's product scope in wafer cleaning, surface preparation, and thermal processing, visitors to the stand can expect discussion of equipment applicable to advanced node front-end-of-line processes, contamination control challenges, and the service infrastructure available to European fabs and R&D facilities.

    Single-wafer wet cleaning systems for front-end-of-line applicationsBatch processing and surface conditioning equipmentThermal processing solutions from the SCREEN Holdings portfolioEuropean field service and applications engineering supportEquipment qualification pathways for advanced node and specialty semiconductor processesWet CleaningWafer ProcessingThermal ProcessingSurface Treatment
    Why visit

    Prioritize this stand if you are a process engineer or equipment procurement manager at a European fab or research institute evaluating wet cleaning or thermal processing tools for advanced or specialty semiconductor production.

    What to ask at the booth

    • Which wet cleaning platforms are currently available for qualification at European fabs?
    • What service and spare-parts response times do you offer for installed tools in Europe?
    • How does your single-wafer cleaning equipment address particle and metallic contamination at sub-5nm nodes?
    • Are there demo or evaluation programs available for R&D institutes in the region?
    • What process chemistries are supported on your current wet bench and single-wafer platforms?

    Before you leave the hall

    Complete your notes before the day ends

    After visiting all five stands, consolidate your notes on the spot rather than relying on memory or collected literature. Confirm follow-up contacts with each booth team and note any product demonstrations scheduled for later show days, as several exhibitors reserve detailed technical sessions for days two and three.

    For a broader view of who is exhibiting at SEMICON Europa 2026, including companies outside this Shared Spotlight, the full TradeShowIntel event page lists additional exhibitors, session schedules, and venue logistics.

    SEMICON Europa 2026 on TradeShowIntel Official SEMICON Europa website

    Frequently asked questions

    Planning this SEMICON Europa 2026 route

    When and where does SEMICON Europa 2026 take place?

    SEMICON Europa 2026 runs from 10 to 13 November 2026 at Messe München in Munich, Germany. The venue is a large multi-hall exhibition centre, and the semiconductor equipment floor is concentrated primarily in Hall B1.

    Which hall should buyers prioritize for this five-exhibitor route?

    Hall B1 is the primary hall for this route. KLA is confirmed at booth B1141 and EV-Group at booth B1241, both in Hall B1. Buyers should verify the hall assignments for Lam Research India Pvt. Ltd., Advantest Singapore, and SCREEN SPE Germany GmbH on the official SEMICON Europa floor plan before arriving, as those positions had not been published at the time this guide was assembled.

    Who is this Shared Spotlight page intended for?

    This page is written for semiconductor equipment buyers, process engineers, and procurement leads who want a structured floor route rather than a random walk. It is particularly relevant for teams evaluating process control, etch and deposition, advanced packaging and 3D integration, automated test, and wet cleaning tools during a single visit to the show.

    How do I contact the exhibitors listed here before the show?

    Each exhibitor card on this page links to the company's profile, which includes contact and website information. Buyers planning detailed technical discussions are encouraged to register interest through each company's website or the SEMICON Europa hosted-meetings programme before the show opens, as booth calendars fill quickly for multi-day events of this scale.

    Are these the only semiconductor equipment exhibitors worth visiting at SEMICON Europa 2026?

    No. This page covers five companies that purchased placement in this Shared Spotlight. SEMICON Europa 2026 includes a much larger exhibitor list spanning materials, equipment, metrology, fab management, MEMS, photonics, and related fields. The full exhibitor directory is available at semiconeuropa.org and on the TradeShowIntel event page for SEMICON Europa 2026.