interpack China 2026 (swop) is a leading trade fair for the packaging and processing industry, taking place November 16–18, 2026 at SNIEC, Shanghai. It showcases the full packaging value chain and attracts global exhibitors and trade visitors.
970+
Exhibitors
47,000+
Attendees
Dates
Nov 16 – 18, 2026
City / country
Shanghai, China
Venue
Shanghai New International Expo Centre - SNIEC
Type
B2B
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Who Exhibits
6 categories represented
Who Attends
6 audience types
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