Dates

    21–23 Apr 2027

    City / country

    Shenzhen, China

    Venue

    Shenzhen Convention and Exhibition Center (Futian), Hall 1

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    Event overview

    Overview

    FAIR plus is a premier event focusing on the AI and robotics industry, taking place from April 21 to 23, 2027, at the Shenzhen Convention and Exhibition Center.

    This event aims to showcase the latest advancements in robotics and AI technologies, facilitating networking and collaboration among industry leaders and innovators.

    TL;DR

    1. 1Event Name: FAIR plus - Fair of AI and Robotics, plus
    2. 2Dates: April 21-23, 2027
    3. 3Location: Shenzhen Convention and Exhibition Center, Hall 1
    4. 4Organized by: Shenzhen Robotics Association
    5. 5Focus on AI and robotics innovations

    Why visit

    Visitors will gain insights into the latest technologies in AI and robotics, network with industry experts, and explore potential partnerships.

    Why exhibit

    Exhibitors can showcase their latest products and technologies to a targeted audience of industry professionals, enhancing visibility and generating leads. The event serves as a strategic platform for companies to connect with potential clients and partners in the robotics and AI fields.

    Attendees, exhibitors & solutions

    Who this event is for

    Visitor profile

    Typical attendee groups you can expect to meet.

    Industry professionals from robotics and AI sectors
    Researchers and academics in technology fields
    Investors looking for opportunities in tech startups
    Government representatives focusing on innovation
    Business leaders seeking partnerships
    Students and young professionals interested in robotics

    Exhibitor profile

    Main supplier and exhibitor segments present at the show.

    Manufacturers of robotic components
    AI software developers
    System integrators for robotics
    Research institutions in robotics and AI
    Consultants in technology and innovation
    Investors in robotics startups

    Product categories

    Key solution areas showcased across the event.

    Robotic components and systems
    AI algorithms and software solutions
    Robotics research and development services
    Automation technologies
    Industrial robots and applications
    Consumer robotics products

    Location & Facilities

    Venue

    Open in Google Maps

    Halls & areas

    1
    Hall 1

    Shenzhen Convention and Exhibition Center (Futian)

    Shenzhen, China

    Attend

    Entry & tickets

    Register

    Who runs the show

    Organisers

    深圳市机器人协会

    EmailCallWebsite

    What's on

    Programme

    6

    Presentation

    1

    Event days

    09:10–12:40

    Typical time

    Speakers

    Calogero M. Oddo

    Calogero M. Oddo

    Associate Professor @ Sant'Anna School of Advanced Studies, Italy

    Touch Science and Engineering in Biorobotics and Bionics

    Qi Dou

    Qi Dou

    Associate Professor @ The Chinese University of Hong Kong, Hong Kong, China

    Robotic Manipulation Requires a Systematic Bridge Between Vision and Action

    Li Wen

    Li Wen

    Professor @ Beihang University, China

    Bioinspired Multimodal Robots: Elevating Interaction in Complex and Diverse Environments

    Sethu Vijayakumar

    Sethu Vijayakumar

    Professor of Robotics @ University of Edinburgh / The Alan Turing Institute, UK

    From Automation to Autonomy: Machine Learning for Next-generation Robotics

    Hae-Won Park

    Hae-Won Park

    Associate Professor @ Korea Advanced Institute of Science and Technology (KAIST), South Korea

    Versatile and Dynamic Legged Robots: From Hardware Design to Control Algorithms

    Fei Gao

    Fei Gao

    Associate Professor @ Zhejiang University, China

    Embodied Intelligence for Aerial Robots

    Wednesday, Apr 21, 2027

    09:10 – 09:45

    Touch Science and Engineering in Biorobotics and Bionics

    Presentation
    Hall 1Hall 1
    09:45 – 10:20

    Robotic Manipulation Requires a Systematic Bridge Between Vision and Action

    Presentation
    Hall 1Hall 1
    10:20 – 10:55

    Bioinspired Multimodal Robots: Elevating Interaction in Complex and Diverse Environments

    Presentation
    Hall 1Hall 1
    10:55 – 11:30

    From Automation to Autonomy: Machine Learning for Next-generation Robotics

    Presentation
    Hall 1Hall 1
    11:30 – 12:05

    Versatile and Dynamic Legged Robots: From Hardware Design to Control Algorithms

    Presentation
    Hall 1Hall 1
    12:05 – 12:40

    Embodied Intelligence for Aerial Robots

    Presentation
    Hall 1Hall 1

    How the last edition performed

    Previous edition

    This edition

    2027

    Next edition

    Not announced yet

    Impact

    A bigger and stronger platform

    FAIR plus is a premier event focusing on the AI and robotics industry, taking place from April 21 to 23, 2027, at the Shenzhen Convention and Exhibition Center. This event aims to showcase the latest advancements in robotics and AI technologies, facilitating networking and collaboration among industry leaders and innovators. The FAIR plus event is crucial for advancing the robotics and AI sectors, providing a platform for showcasing innovations, fostering collaborations, and.

    Audience quality

    High-value decision-makers

    Visitors typically include Industry professionals from robotics and AI sectors, Researchers and academics in technology fields, Investors looking for opportunities in tech startups, Government representatives focusing on innovation. Event Name: FAIR plus - Fair of AI and Robotics, plus. Dates: April 21-23, 2027. Location: Shenzhen Convention and Exhibition Center, Hall 1. Organized by: Shenzhen Robotics Association. FAIR plus - Fair of AI and Robotics, plus attracts an audience aligned with the organiser's.

    Exhibitor outcomes

    Real business growth

    Exhibitors can showcase their latest products and technologies to a targeted audience of industry professionals, enhancing visibility and generating leads. The event serves as a strategic platform for companies to connect with potential clients and partners in the robotics and AI fields. Exhibitor categories include Manufacturers of robotic components, AI software developers, System integrators for robotics, Research institutions in robotics and AI. Exhibitors use the event for lead generation, product launches,.

    Intelligence

    Market context

    Key market insights, trends, news and related events to help you understand the bigger picture.

    Shenzhen, China

    Why it matters

    Attending FAIR plus - Fair of AI and Robotics, plus on 2027-04-21 to 2027-04-23 in Shenzhen lets buyers and specifiers benchmark suppliers, see live demonstrations, and compress months of vendor meetings into one focused trade visit — worthwhile when your category roadmap aligns with the official exhibitor profile.

    Industry trends

    Key trends shaping this market and its wider industry.

    01

    Digital buyer journeys

    Professionals expect pre-show agendas, product finders, and meeting tools; suppliers align demos and literature to short on-stand decision cycles.

    02

    Sustainability in procurement

    Energy use, recyclable materials, and carbon reporting increasingly appear in RFPs and exhibitor scorecards across industrial trade fairs.

    03

    Automation and labour efficiency

    Visitors benchmark machinery, software, and services that reduce downtime, staffing pressure, and total cost of ownership.

    04

    Regional supply-chain resilience

    Buyers diversify suppliers across Europe, MENA, and Asia while favouring vendors with local service, spare parts, and training.

    05

    Hybrid engagement models

    Live demonstrations remain decisive, but follow-up webinars, digital catalogues, and year-round supplier portals extend the commercial window after the show.

    Technology trade fair circuit

    Book hotels and meetings 8–12 weeks before opening day; peer shows in the same sector often fall in adjacent months.

    Buyers covering technology often plan FAIR plus - Fair of AI and Robotics, plus alongside regional peer shows to compare products, pricing, and service coverage across markets.

    Pre-show

    Confirm exhibitor meetings and product demos for FAIR plus - Fair of AI and Robotics, plus.

    Show week

    Hall walk-throughs, live demos, and supplier negotiations.

    Peer events are widely known sector fairs; verify dates on each organiser website before booking.

    Plan your trip

    Travel & logistics

    Local currency · CNY

    Weather

    April in Shenzhen typically sees 20–26°C. Warm spring. Breathable fabrics; light rain protection. Check the forecast a week before travel and pack for walking between halls and outdoor transfers.

    Plan for the climate

    Check temperatures and pack accordingly

    Venue connectivity

    Confirm mobile roaming or local SIM options for business visitors to China.

    Ride-hailing

    Taxis

    Public transit

    Car rentals

    Cultural notes

    Useful information to help you have a smooth and respectful visit.

    Registration

    Confirm registration and venue access with the organiser before travelling to Shenzhen.

    Arrival

    Arrive early on the first show day for orientation and security screening.

    Practical guides

    Visitor & Exhibitor Essentials

    Everything needed to arrive prepared, navigate the event, and make the visit productive.

    Flights

    Compare flights to the nearest international gateway serving Shenzhen; confirm ground transport on the organiser site.

    Transport

    Get to the venue and around the city with these options.

    Airport → venue: Use the nearest international airport serving Shenzhen; Metro, train or taxi links are typically available to the venue district.

    Hotel → venue: Plan road/rail access to Shenzhen Convention and Exhibition Center (Futian); confirm travel guidance on the organiser site.

    Ride-hail: Ride-hailing apps are commonly used in Shenzhen; confirm local availability before travel.

    Public transit: Check local bus/metro options for routes to Shenzhen Convention and Exhibition Center (Futian).

    Parking: On-site parking is available at Shenzhen Convention and Exhibition Center (Futian); confirm daily rates and hall access on the organiser or venue site.

    Weather

    Plan and pack for the event climate.

    Month: April 2027

    Temperature: 12–20°C

    Seasonality: Pleasant spring.

    Packing: April in Shenzhen typically sees 12–20°C. Pleasant spring. Light coat for evenings.

    Plan your trip

    Planning

    1

    Confirm China visa status and passport validity — Apply for a China visa or check visa-free eligibility well ahead of the FAIR plus show on 21-23 April 2027 in Shenzhen; passport must be valid for at least six months.

    2

    Book flights to Shenzhen Bao'an International Airport (SZX) — Aim to arrive by 20 April, the day before opening, so you have time to settle before Hall 1 opens.

    3

    Reserve a hotel near Shenzhen Convention and Exhibition Center (Futian) — Futian district properties are walking or short metro distance from Hall 1; book early because April is busy trade-fair season in Shenzhen.

    4

    Complete online visitor registration at fairplus.cn — Pre-register through the official FAIR plus site to receive a badge QR code and avoid on-site queues.

    5

    Download the hall plan and conference programme — Review the Hall 1 exhibitor layout and the AI and robotics session schedule published by the organiser Shenzhen Robotics Association.

    6

    Pre-schedule B2B meetings with robotics and AI suppliers — Use organiser matchmaking or contact exhibitors directly to fix meeting slots before you travel.

    7

    Shortlist sessions and product demos to attend — Prioritise AI, robotics, automation and components demos that match your sourcing or partnership goals.

    8

    Plan local transport between hotel and venue — Shenzhen metro lines and taxis serve the Futian CBD; budget for metro fares or short taxi rides to the venue.

    9

    Prepare business cards, product specs and meeting documents — Bring printed materials plus digital copies; dual-language cards help with Chinese-speaking exhibitors.

    10

    Check the local forecast and finalise your packing list — Pack light layers, business attire for meetings, a universal power adapter and a compact umbrella.

    11

    Arrange travel insurance and local payment methods — Confirm medical and travel cover, and set up a mobile payment app linked to an international card for use in Shenzhen.

    12

    Plan arrival day and badge collection at the venue — Collect your badge at the Hall 1 registration desk on 21 April and allow extra time for entry security screening.

    Decision

    Visit, exhibit, or skip?

    Should you go?

    Pick the closest answer for each. Your recommendation updates live.

    QUESTION 1 OF 6

    What is your primary role?

    Decision matrix

    Compare participation options side by side to choose the best fit for your objectives.

    visit

    Your category focus and target suppliers align with the official exhibitor profile.

    Best for

    Buyers, engineers, and delegates sourcing Robotic components and systems solutions and benchmarking suppliers at FAIR plus - Fair of AI and Robotics, plus in Shenzhen.

    Min. budget

    $350.00

    Timeline

    4–8 weeks before opening day for registration, hotels, and travel.

    Risks

    Session times and ticket tiers may change — confirm the official agenda before booking.

    exhibit

    You have a defined lead-generation or distributor recruitment goal for this market.

    Best for

    Brands and manufacturers launching Robotic components and systems products who need qualified meetings with the event's trade audience.

    Min. budget

    $2,200.00

    Timeline

    3–6 months for stand booking, freight, staffing, and pre-show marketing.

    Risks

    Booth pricing and corner premiums vary by hall — confirm with the organiser sales team.

    skip

    Audience, geography, or commercial goals do not justify travel and stand costs this cycle.

    Best for

    Teams with weak category fit, budget constraints, or overlapping commitments during the Shenzhen show week.

    Timeline

    N/A

    Risks

    No major risks listed.

    Gallery

    Photos

    Official imagery from FAIR plus - Fair of AI and Robotics, plus
    Official imagery from FAIR plus - Fair of AI and Robotics, plus

    Trust footer

    Sources

    5

    References

    1

    Publishers

    0

    Date checked

    1

    FAIR plus

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