BONDEXPO 2026
The 18th Bondexpo is an international trade fair for bonding technology, held from 6 to 8 October 2026 at Messe Stuttgart in Germany. It covers the complete joining/bonding process chain including adhesive bonding, potting, sealing, and foaming. The event runs in parallel with Motek, the international trade fair for automation in production and assembly, forming a powerful trade fair alliance.
Dates
Oct 6 – 8, 2026
City / country
Stuttgart, Germany
Venue
New Stuttgart Trade Fair Centre
Type
B2B
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Notable exhibitors
Companies exhibiting at BONDEXPO 2026 include AAT Aston GmbH Geräte für Elektronik- und Kabelverarbeitung, ABB AB, ABNOX AG, ACI Laser GmbH and ACURITY GmbH.
- AAT Aston GmbH Geräte für Elektronik- und Kabelverarbeitung
- ABB AB
- ABNOX AG
- ACI Laser GmbH
- ACURITY GmbH
- Exhibit at Bondexpo to connect with key decision-makers in the bonding and joining industry, showcasing your solutions to a targeted audience of engineers and technicians.
- Benefit from the parallel Motek trade fair to reach a broader automation-focused audience, maximizing your exposure and ROI.
Audience at a Glance
Who Exhibits
Exhibitor Profile
8 categories represented
- Adhesive and Sealant Manufacturers
- Dispensing and Application Equipment
- Surface Treatment and Pretreatment
- Testing and Measurement Equipment
- Automation and Robotics
- Raw Material Suppliers
- Contract Manufacturing
- Engineering Services
Who Attends
Visitor Profile
8 audience types
- Production Engineers
- Design Engineers
- Quality Assurance Managers
- Maintenance Managers
- Purchasing Managers
- Research and Development
- Technical Directors
- Plant Managers
Industries & Sectors
Coverage & Spotlights
No exhibitor spotlights published yet for this event.
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