APEC 2027

Attendees, exhibitors & solutions

Who this event is for

Industry trends

Key trends shaping this market and its wider industry.

Market news

Latest updates from across the market.

Arrival airports

Choose from the following airports, with convenient access to the event and venue.

Hotel tiers

A range of accommodation options near the venue and across key areas.

Local transport

Get around the city with these convenient transport options.

Frequently asked

Glossary

1

Wide-bandgap (WBG) semiconductor

A material such as silicon carbide (SiC) or gallium nitride (GaN) with a larger bandgap than silicon, allowing higher blocking voltage, faster switching and lower conduction loss in power converters.

2

SiC MOSFET

A silicon carbide metal-oxide-semiconductor field-effect transistor used in high-voltage, high-temperature designs such as EV traction inverters, solar string inverters and industrial drives.

3

GaN HEMT

A gallium nitride high-electron-mobility transistor, a lateral device used in high-frequency, low-to-medium voltage converters such as server power supplies, fast chargers and LiDAR drivers.

4

Power module

A packaged assembly of dies, substrates, interconnects and baseplate or moulded body that a designer mounts as one switching unit; many APEC exhibits feature modules with double-sided cooling and integrated current or temperature sensing.

5

Gate driver

The circuit that delivers charge to a power device gate, sets switching speed and adds protection such as desaturation detection, active Miller clamping and short-circuit shutdown.

6

Switching frequency

How often a power device is turned on and off, typically from tens of kHz to several MHz; higher frequency shrinks magnetics and capacitors but raises switching loss and electromagnetic emissions.

7

PFC (power factor correction)

The input stage that shapes line current to follow the mains voltage so the converter meets harmonic standards such as IEC 61000-3-2; bridgeless and totem-pole topologies dominate server, telecom and charger designs.

8

Magnetics

Inductors and transformers in a converter; core material (ferrite, nanocrystalline, powdered iron), winding loss and thermal path largely decide achievable power density.

9

Digital power and PMBus

Converters controlled by a microcontroller or DSP with telemetry and configuration over PMBus or I2C, enabling adaptive control loops, remote monitoring and firmware updates.

10

Junction temperature and thermal resistance

Tj is the temperature of the semiconductor die, and Rth describes how heat flows from die to case to heatsink; both set the derating and lifetime assumptions behind a converter design.

11

AEC-Q101 qualification

A stress-test standard for discrete semiconductors used in automotive applications, covering high-temperature operating life, temperature cycling and humidity testing; commonly cited alongside JEDEC standards in device papers.

12

EMI / EMC

Electromagnetic interference and compatibility: the conducted and radiated emissions a converter produces and its immunity to external noise, measured against limits such as FCC Part 15 or CISPR standards.

13

Motor drive inverter

A three-phase switching stage that converts DC into variable-frequency AC for an electric machine, central to appliance, industrial and traction applications covered in APEC technical sessions.